General Films
PET/PP protective films coated with pressure-sensitive adhesive for die-cutting, process and shipping protection of electronics. ORISUN General Films.
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应用领域
半导体
晶圆切割保护与玻璃加工，支持 UV/热减粘。
切割、研磨与玻璃加工要求膜材切割时粘得牢、加工后撕得净。本杉晶圆保护方案以洁净涂布与申克博士在线检测为基础，将缺陷流出降到最低。
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What We Deliver
我们提供
- 晶圆切割、研磨与背面保护
- 粘着稳定、剥离干净、无残留
- 千级/百级洁净车间涂布
- 无尘洁净分条与包装
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Functional Films
UV and thermal debonding films and high-temperature protective films (up to 260°C) for glass processing and semiconductor wafer dicing. ORISUN Functional Films.
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Optical Films
Optical-grade protective films: polarizer protection up to 2.6 m wide, explosion-proof, 2D/3D curved-screen films and AR/AG/HC functional coatings. ORISUN Optical Films.
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General Adhesive Materials
Double-sided and single-sided PET tapes, tissue and non-woven tapes, substrate-free adhesive films and OCA optical adhesive for electronics. ORISUN General Adhesives.
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Functional Adhesive Materials
Conductive tapes, thermally conductive and flame-retardant tapes, foam tapes, light blocking, insulation and AB tapes for demanding assembly. ORISUN Functional Adhesives.
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Eco-Friendly Materials
Bio-based and eco-friendly PET tapes: 100% PCR PET base with bio-based carbon acrylic adhesive for sustainable electronics design. ORISUN Eco-Friendly Materials.
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Packaging Materials
BOPP packing tape with strong adhesion, cushioning, puncture and tear resistance for carton sealing, bundling and die-cut waste discharge. ORISUN Packaging Materials.
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Release Materials
Silicone, non-silicone, anti-static, OCA and polarizer release films with customizable release force, thickness and color. ORISUN Release Materials.
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