Optical Films
Optical-grade protective films: polarizer protection up to 2.6 m wide, explosion-proof, 2D/3D curved-screen films and AR/AG/HC functional coatings. ORISUN Optical Films.
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Industry Solution
Films & Tapes for Semiconductor
Wafer dicing protection and glass processing with UV/thermal debonding.
Dicing, grinding and glass processing demand films that hold tight during cutting and release cleanly afterwards. ORISUN wafer-protection constructions combine cleanroom coating with inline Dr. Schenck inspection to keep defect escape at a minimum.
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What We Deliver
Built for Semiconductor
- Wafer dicing, grinding and backside protection
- Stable adhesion with clean removal, no residue
- Class-1000 / class-100 cleanroom coating
- Particle-free clean slitting and packaging
Recommended Materials
Product Lines for This Industry
These ORISUN product lines are most often specified for semiconductor applications.
Functional Films
UV and thermal debonding films and high-temperature protective films (up to 260°C) for glass processing and semiconductor wafer dicing. ORISUN Functional Films.
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Release Materials
Silicone, non-silicone, anti-static, OCA and polarizer release films with customizable release force, thickness and color. ORISUN Release Materials.
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